Composite materials (pastes) specification

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Composite materials (pastes) specification.

Dielectric paste – DP
Dielectric paste (DP) has excellent insulation parameters, low distortion and high adhesion. Paste is compatible with resistive, conductive "Microptik" pastes. It is a key material for the thick-film heating elements. There are no toxic elements in Dielectric paste.
DP are used to make glassy coatings (enamels) on metallic substrates, protective dielectric coatings on electrically conductive layers, interlayer insulation of multi-level switching boards.

Dielectric Paste parameters and characteristics

The base material High chromium alloy steel
Colour white, purple, gray, blue
Film thickness not less than 150 microns
Resistance of insulating film layer at a thickness of not less than 150 microns, and a temperature of 20 ± 2 °C. higher than 1012 Ohms / square
Electric strength of the insulation layer not less than 20000 V/mm
 Leakage current at a layer thickness of not less than 150 microns and at temperature of 500 °C. 1 mA per 1 kW of the electric power of the heating element

Resistive paste– RP
Resistive paste  (RP) is used to create a resistive heating layer in thick-film heating elements. Good compatible with the dielectric layer created on the basis of PD paste. There are no toxic elements in Resistive paste.
RP is a suspension of micro/nano powders of refractory compounds, glass and other components in an organic binder.  

Resistive Paste parameters and characteristics

The base material a dielectric layer paste on the basis of DP paste
Colour gray, black
Surface resistivity of the square of the film 0,03 – 10,0 Ohms/square
Increasing of size of the film due to the spreading of pasta not more than 50 microns
Adhesion to the substrate dielectric layer not less than 50 kg/cm2
Temperature coefficient of resistance (TCR) of the films in the temperature range from +20 ˚C to +600 ˚C does not exceed 3*10 -3 1/˚C
The films are allow to be heat treated 10 times without degrading their quality coverage  

Contact paste– CP
Contact paste (CP) is used to connect wires to the pads of thick-film heating elements on substrates of ceramic and enameled metal.
There are no toxic elements in the Contact Paste.

Contact paste parameters and characteristics

The base material a dielectric layer paste on the basis of DP
Colour black, gray
Surface resistivity of the square of the film 0,02 - 0,05 Ohms/square
The quantity of the film adhesion to the substrate surface not less than 50 kg/cm2
The films are allow to be heat treated 10 times without degrading their quality coverage  

Conductive paste CDP
Conductive Paste of (CDP) is used for switching elements of resistors, capacitors. There are no toxic elements in the Conductive Paste.
CDP pastes are made by the suspension of refractory compounds, glass and other components in an organic binder.

Condactive Paste parameters and characteristics

The base material a dielectric layer paste on the basis of DP paste
Colour black, gray
Surface resistivity of the square of the film 0,02 - 0,05 Ohms/square
The quantity of the film adhesion to the substrate surface not less than 50 kg/cm2
The films are allow to be heat treated 10 times without degrading their quality coverage  

Pastes Features: 
- Adhesion to metal and ceramic bases is not less than 50 kg/cm²;
- The minimum width of lines is 250 microns;
- The minimum distance between the lines is 300 microns;
- Temperature coef. 10⁻⁶/˚C +40 ... +400;
- Specific power dissipation 50 W/cm²
- Operating temperature range -60 ... +650 ˚C;
- Operating Voltage 1.5 - 750 V AC/DC. 

Type Pastes Description Nominal Value, Оm/sq.
1 DP-1С dielectric -
2 DP-3C dielectric -
3 RP-0,05 rezistive 0,05
4 RP-0,1 rezistive 0,1
5 RP-0,3 rezistive 0,3
6 RP-0,5 rezistive 0,5
7 RP-0,7 rezistive 0,7
8 RP-1,0 rezistive 1,0
9 RP-1,5 rezistive 1,5
10 RP-2,0 rezistive 2,0
11 RP-3,0 rezistive 3,0
12 RP-5,0 rezistive 5,0
13 RP-10,0 rezistive 10,0
14 RP-20,0 rezistive 20,0
15 RP-50,0 rezistive 50,0
16 CP contact -